Infineon BSD235C 2 Type N, Type P-Channel MOSFET, 950 mA, 20 V Enhancement, 6-Pin SOT-363 BSD235CH6327XTSA1
- RS Stock No.:
- 250-0522
- Mfr. Part No.:
- BSD235CH6327XTSA1
- Manufacturer:
- Infineon
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Units | Per unit | Per Reel* | Saving |
|---|---|---|---|
| 3000 - 3000 | SGD0.155 | SGD465.00 | - |
| 6000 - 6000 | SGD0.14 | SGD420.00 | 9% |
| 9000 + | SGD0.126 | SGD378.00 | 18% |
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- RS Stock No.:
- 250-0522
- Mfr. Part No.:
- BSD235CH6327XTSA1
- Manufacturer:
- Infineon
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N, Type P | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 950mA | |
| Maximum Drain Source Voltage Vds | 20V | |
| Package Type | SOT-363 | |
| Series | BSD235C | |
| Mount Type | Surface Mount | |
| Pin Count | 6 | |
| Channel Mode | Enhancement | |
| Maximum Power Dissipation Pd | 0.5W | |
| Minimum Operating Temperature | -55°C | |
| Maximum Gate Source Voltage Vgs | 1.20V | |
| Forward Voltage Vf | 1.1V | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Number of Elements per Chip | 2 | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N, Type P | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 950mA | ||
Maximum Drain Source Voltage Vds 20V | ||
Package Type SOT-363 | ||
Series BSD235C | ||
Mount Type Surface Mount | ||
Pin Count 6 | ||
Channel Mode Enhancement | ||
Maximum Power Dissipation Pd 0.5W | ||
Minimum Operating Temperature -55°C | ||
Maximum Gate Source Voltage Vgs 1.20V | ||
Forward Voltage Vf 1.1V | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Number of Elements per Chip 2 | ||
Automotive Standard AEC-Q101 | ||
Infineon BSD235C Series MOSFET, 20V Maximum Drain-Source Voltage, 0.95A Maximum Continuous Drain Current - BSD235CH6327XTSA1
Features and Benefits:
• 0.95A continuous drain current supports moderate current loads
• 1.2V gate‑source rating allows low‑voltage gate drive operation
• 0.5W power dissipation permits Compact thermal budgeting
• 150°C maximum operating temperature allows elevated ambient use
Applications
• Ideal for complementary push‑pull signal stages
• Used with low‑voltage control logic for gate driving
• Can be used for redundant dual‑element power management
• Used for Compact board designs requiring RoHS compliance
How many transistor elements are integrated on the chip?
What pin count and package should I plan for in PCB layout?
What temperature extremes can it withstand during operation?
Is the device suitable where material restrictions apply?
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