Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 83 mm 150 mm 80 mm

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Subtotal (1 unit)*

SGD310.37

(exc. GST)

SGD338.30

(inc. GST)

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  • Plus 6 unit(s) shipping from 02 February 2026
  • Plus 3 unit(s) shipping from 09 March 2026
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Units
Per unit
1 - 99SGD310.37
100 - 249SGD301.69
250 - 499SGD292.88
500 +SGD288.43

*price indicative

RS Stock No.:
692-0626
Mfr. Part No.:
LA 9 150 24 V
Manufacturer:
Fischer Elektronik
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Brand

Fischer Elektronik

Product Type

Heatsink

For Use With

Universal Rectangular Alu with Fan

Length

150mm

Width

80 mm

Height

83mm

Finish

Black Anodised

Standards/Approvals

No

Application

Cooling

Material

Aluminium

Special Features

Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan

COO (Country of Origin):
HU

Fischer Elektronik Cooling Aggregates with Axial Fans


Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal.

Geometry of optimising the airflow

Particularly effective heat dissipation

Compact construction

Milled flat semiconductor mounting surface

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