Chemtronics CW2400 Liquid Adhesive, Grey, 14 g

RS Stock No.:: 496-265
Distrelec Article No.:: 180-86-712
Mfr. Part No.:: CW2400
Manufacturer:: Chemtronics

Chemtronics CW2400 Liquid Adhesive, Grey, 14 g

Subtotal (1 unit)*

SGD174.15

(exc. GST)

SGD189.82

(inc. GST)

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In Stock

27 unit(s) ready to ship from another location
Plus 36 unit(s) shipping from 22 June 2026
Plus 60 unit(s) shipping from 06 July 2026

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Units	Per unit
1 +	SGD174.15

*price indicative

RS Stock No.:: 496-265
Distrelec Article No.:: 180-86-712
Mfr. Part No.:: CW2400
Manufacturer:: Chemtronics

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Chemtronics
	Product Type	Adhesive
	Trade Name	CW2400
	Material Compatibility	Plastic, Metal
	Colour	Grey
	Product Form	Liquid
	Standards/Approvals	Annex II, as amended by UK REACH SI 2019/758, Conforms to Regulation (EC) No. 1907/2006 (REACH)
	Package Size	14 g
	Base Chemical	Conductive Adhesive

	Select all
	Brand Chemtronics
	Product Type Adhesive
	Trade Name CW2400
	Material Compatibility Plastic, Metal
	Colour Grey
	Product Form Liquid
	Standards/Approvals Annex II, as amended by UK REACH SI 2019/758, Conforms to Regulation (EC) No. 1907/2006 (REACH)
	Package Size 14 g
	Base Chemical Conductive Adhesive

COO (Country of Origin):: US

Chemtronics Conductive Epoxy

The Chemtronics 0.25oz silver conductive epoxy is a two-part adhesive used in prototype, repair and general conductive bonding with a volume resistivity of less than 0.001ohm-cm. It features strong mechanical bond, excellent electrical conductivity and quick room temperature curing. The conductive epoxy bonds aggressively to a wide variety of materials and are generally compatible with most materials used in printed circuit board fabrication. As with any adhesive/sealant, compatibility with substrate should be determined on a non-critical area before use. it has an extended pot life for high strength conductive bonds. Components can be easily placed and replaced before full cure occurs and for an accelerated cure, simply heat the material to 100°C (212°F).

Features and Benefits

Cure time is 24 hours

Simple mixing ratios

High strength bond

Operating temperature ranges between -91°C (-131°F) and 100°C (212°F)

Pot life is 8-10 minutes at 25⁰C after mixing

Quick solderless electronic connections

Repairs defective traces and creates jumpers on boards

Mixed material provides 5-minute work time, fast cure

Conductive silver epoxy provides excellent electrical conductivity

Applications

Conductive bonds between heat sensitive components

Solderless surface mount connections

Circuit board trace repairs

Static discharge and grounding

Solder repairs

Conductive structural adhesions

Certifications

ANSI/ESD S20.20:2014

BS EN 61340-5-1:2007