Infineon TT320N16SOFHPSA1, Thyristor Module 1600 V 9500 A, 320 A 150 mA 1.47 V 7-Pin
- RS Stock No.:
- 217-7235
- Mfr. Part No.:
- TT320N16SOFHPSA1
- Manufacturer:
- Infineon
This image is representative of the product range
Bulk discount available
Subtotal (1 unit)*
SGD135.46
(exc. GST)
SGD147.65
(inc. GST)
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In Stock
- 39 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 9 | SGD135.46 |
| 10 - 99 | SGD124.18 |
| 100 - 249 | SGD114.64 |
| 250 - 499 | SGD106.43 |
| 500 + | SGD103.50 |
*price indicative
- RS Stock No.:
- 217-7235
- Mfr. Part No.:
- TT320N16SOFHPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Rated Average On-State Current Irms | 320A | |
| Product Type | Thyristor Module | |
| Repetitive Peak Reverse Voltage VDRM | 1600V | |
| Surge Current Rating | 9500A | |
| Maximum Gate Trigger Current Igt | 150mA | |
| Pin Count | 7 | |
| Maximum Holding Current Ih | 150mA | |
| Maximum Gate Trigger Voltage Vgt | 2V | |
| Maximum Operating Temperature | 130°C | |
| Standards/Approvals | No | |
| Repetitive Peak Off-State Current | 60mA | |
| Automotive Standard | No | |
| Peak On-State Voltage | 1.47V | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Rated Average On-State Current Irms 320A | ||
Product Type Thyristor Module | ||
Repetitive Peak Reverse Voltage VDRM 1600V | ||
Surge Current Rating 9500A | ||
Maximum Gate Trigger Current Igt 150mA | ||
Pin Count 7 | ||
Maximum Holding Current Ih 150mA | ||
Maximum Gate Trigger Voltage Vgt 2V | ||
Maximum Operating Temperature 130°C | ||
Standards/Approvals No | ||
Repetitive Peak Off-State Current 60mA | ||
Automotive Standard No | ||
Peak On-State Voltage 1.47V | ||
The Infineon Thyristor/Thyristor 50 mm eco block 1600 V, 320 A module for phase control in solder bond technology. This module is also available with pre-applied Thermal Interface Material.
Solder bond technology
Industrial standard package
Electrically insulated base plate
Cost effective solution for higher competitiveness
Predictably high performance and lifetime due to 100% x-ray monitoring
Solid base plate for fast and easy mounting
Optimized for less performant heat sinks