Infineon FP15R12W1T7BOMA1 3 Phase IGBT, 15 A 1200 V AG-EASY1B-711, Chassis
- RS Stock No.:
- 258-0859
- Mfr. Part No.:
- FP15R12W1T7BOMA1
- Manufacturer:
- Infineon
This image is representative of the product range
Bulk discount available
Subtotal (1 unit)*
SGD47.14
(exc. GST)
SGD51.38
(inc. GST)
Add 4 units to get free delivery
In Stock
- Plus 19 unit(s) shipping from 16 February 2026
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Units | Per unit |
|---|---|
| 1 - 1 | SGD47.14 |
| 2 - 4 | SGD43.97 |
| 5 - 9 | SGD42.12 |
| 10 - 14 | SGD40.05 |
| 15 + | SGD37.75 |
*price indicative
- RS Stock No.:
- 258-0859
- Mfr. Part No.:
- FP15R12W1T7BOMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 15A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 20mW | |
| Package Type | AG-EASY1B-711 | |
| Configuration | 3 Phase | |
| Mount Type | Chassis | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Width | 62.8 mm | |
| Height | 12mm | |
| Length | 33mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 15A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 20mW | ||
Package Type AG-EASY1B-711 | ||
Configuration 3 Phase | ||
Mount Type Chassis | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Width 62.8 mm | ||
Height 12mm | ||
Length 33mm | ||
Automotive Standard No | ||
The Infineon EasyPIM 1B 1200 V, 15 A three phase input rectifier PIM IGBT module with TRENCHSTOP IGBT7, emitter controlled 7 diode and NTC. Also available with pre-applied thermal interface material.
High power density
Compact design
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