Infineon FP15R12KE3GBPSA1 3 Phase IGBT, 25 A 1200 V AG-ECONO2C-311, Chassis
- RS Stock No.:
- 258-0857
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
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Bulk discount available
Subtotal (1 unit)*
SGD98.92
(exc. GST)
SGD107.82
(inc. GST)
Add 2 units to get free delivery
In Stock
- 2 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 1 | SGD98.92 |
| 2 - 3 | SGD97.12 |
| 4 - 5 | SGD91.56 |
| 6 - 7 | SGD89.73 |
| 8 + | SGD87.94 |
*price indicative
- RS Stock No.:
- 258-0857
- Mfr. Part No.:
- FP15R12KE3GBPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 25A | |
| Maximum Collector Emitter Voltage Vceo | 1200V | |
| Maximum Power Dissipation Pd | 105W | |
| Configuration | 3 Phase | |
| Package Type | AG-ECONO2C-311 | |
| Mount Type | Chassis | |
| Minimum Operating Temperature | -40°C | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Length | 107.5mm | |
| Height | 17mm | |
| Width | 45 mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 25A | ||
Maximum Collector Emitter Voltage Vceo 1200V | ||
Maximum Power Dissipation Pd 105W | ||
Configuration 3 Phase | ||
Package Type AG-ECONO2C-311 | ||
Mount Type Chassis | ||
Minimum Operating Temperature -40°C | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
Length 107.5mm | ||
Height 17mm | ||
Width 45 mm | ||
Automotive Standard No | ||
The Infineon EconoPIM 2 1200V three phase PIM IGBT module with IGBT3 and NTC is optimized customers development cycle time and cost, its fast, reliable and low cost mounting concept.
Low stray inductance module design
High reliability and power density
Copper base plate for optimized heat spread
Solder able pins
Related links
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