Infineon IGBT Module 650 V, Through Hole

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Subtotal (1 tray of 15 units)*

SGD1,375.005

(exc. GST)

SGD1,498.755

(inc. GST)

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Units
Per unit
Per Tray*
15 - 15SGD91.667SGD1,375.01
30 - 30SGD87.084SGD1,306.26
45 +SGD82.729SGD1,240.94

*price indicative

RS Stock No.:
248-1197
Mfr. Part No.:
DF300R07W2H3B77BPSA1
Manufacturer:
Infineon
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Brand

Infineon

Product Type

IGBT Module

Maximum Collector Emitter Voltage Vceo

650V

Number of Transistors

4

Maximum Power Dissipation Pd

20mW

Mount Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Gate Emitter Voltage VGEO

20 V

Maximum Collector Emitter Saturation Voltage VceSAT

2V

Maximum Operating Temperature

150°C

Height

12mm

Standards/Approvals

RoHS

Series

DF300R07W2H3_B77

Width

42.5 mm

Length

56.7mm

Automotive Standard

No

The Infineon makes this EasyPACK 2B 650 V, 100 A 3-level IGBT module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC. This device offers easy of use compact design, optimized performance. The device provides added benefits like increased blocking voltage capability up to 650 V, low inductive design, low switching losses and low VCE,sat. It uses an Al2O3 substrate with low thermal resistance and PressFIT contact technology. This device offers rugged mounting due to integrated mounting clamp. This device has Booster configuration and uses IGBT HighSpeed 3 technology.

Best cost-performance ratio with reduced system costs

High degree of freedom in design

Highest efficiency and power density

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