Infineon FS1150R08A8P3LBCHPSA1, Type N-Channel Half Bridge IGBT, 1.15 kA 750 V AQG-324, Screw
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Manufacturer:
- Infineon
Subtotal (1 unit)*
SGD1,563.52
(exc. GST)
SGD1,704.24
(inc. GST)
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- Shipping from 24 August 2026
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Units | Per unit |
|---|---|
| 1 + | SGD1,563.52 |
*price indicative
- RS Stock No.:
- 349-028
- Mfr. Part No.:
- FS1150R08A8P3LBCHPSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 1.15kA | |
| Maximum Collector Emitter Voltage Vceo | 750V | |
| Number of Transistors | 6 | |
| Maximum Power Dissipation Pd | 10000W | |
| Configuration | Half Bridge | |
| Package Type | AQG-324 | |
| Mount Type | Screw | |
| Channel Type | Type N | |
| Minimum Operating Temperature | -40°C | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.09V | |
| Maximum Gate Emitter Voltage VGEO | ±20 V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS, UL 94 V0 | |
| Automotive Standard | AQG 324 | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 1.15kA | ||
Maximum Collector Emitter Voltage Vceo 750V | ||
Number of Transistors 6 | ||
Maximum Power Dissipation Pd 10000W | ||
Configuration Half Bridge | ||
Package Type AQG-324 | ||
Mount Type Screw | ||
Channel Type Type N | ||
Minimum Operating Temperature -40°C | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.09V | ||
Maximum Gate Emitter Voltage VGEO ±20 V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS, UL 94 V0 | ||
Automotive Standard AQG 324 | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineons next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
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