AAVID THERMALLOY Heatsink, Power Semiconductors 54 mm 50 mm 15 mm
- RS Stock No.:
- 712-4396
- Mfr. Part No.:
- 0S565/50/B
- Manufacturer:
- AAVID THERMALLOY
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Subtotal (1 unit)*
SGD15.32
(exc. GST)
SGD16.70
(inc. GST)
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- Shipping from 01 March 2027
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Units | Per unit |
|---|---|
| 1 + | SGD15.32 |
*price indicative
- RS Stock No.:
- 712-4396
- Mfr. Part No.:
- 0S565/50/B
- Manufacturer:
- AAVID THERMALLOY
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | AAVID THERMALLOY | |
| For Use With | Power Semiconductors | |
| Product Type | Heatsink | |
| Length | 50mm | |
| Width | 15 mm | |
| Height | 54mm | |
| Fastening | Clip | |
| Colour | Black | |
| Series | THE MAX CLIP SYSTEM | |
| Finish | Nickel Plated | |
| Compatible Package Type | TO-0218, TO-220, TO-247, Max247, TO-247J, Max220 | |
| Standards/Approvals | U.S. Patent 5.991.151 | |
| Application | Mounting A Semiconductor to The Heatsink | |
| Material | Special Spring Steel | |
| Special Features | Compatible With Thermal Interface Materials, High Elasticity, Constant Pressure, Corrosion Resistance, Easy Assembly/disassembly | |
| Select all | ||
|---|---|---|
Brand AAVID THERMALLOY | ||
For Use With Power Semiconductors | ||
Product Type Heatsink | ||
Length 50mm | ||
Width 15 mm | ||
Height 54mm | ||
Fastening Clip | ||
Colour Black | ||
Series THE MAX CLIP SYSTEM | ||
Finish Nickel Plated | ||
Compatible Package Type TO-0218, TO-220, TO-247, Max247, TO-247J, Max220 | ||
Standards/Approvals U.S. Patent 5.991.151 | ||
Application Mounting A Semiconductor to The Heatsink | ||
Material Special Spring Steel | ||
Special Features Compatible With Thermal Interface Materials, High Elasticity, Constant Pressure, Corrosion Resistance, Easy Assembly/disassembly | ||
The Max Clip System™ OS565 Profile
Clip mounting technology offers high reliability
Economic and manufacturing benefits that replace rivets and screws
Simplified and rapid assembly for mounting a semiconductor to the heatsink
Improved performance with the use of special thermal interface materials
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