Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

BGA Heatsinks