STMicroelectronics HSP051-4M5 4-Element Uni-Directional TVS Diode, 5-Pin DFN
- RS Stock No.:
- 192-3834
- Mfr. Part No.:
- HSP051-4M5
- Manufacturer:
- STMicroelectronics
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- RS Stock No.:
- 192-3834
- Mfr. Part No.:
- HSP051-4M5
- Manufacturer:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Direction Type | Uni-Directional | |
| Product Type | TVS Diode | |
| Diode Configuration | Array | |
| Minimum Breakdown Voltage Vbr | 5.7V | |
| Mount Type | Surface | |
| Package Type | DFN | |
| Maximum Reverse Stand-off Voltage Vwm | 5V | |
| Pin Count | 5 | |
| Minimum Operating Temperature | -40°C | |
| ESD Protection | Yes | |
| Maximum Peak Pulse Current Ippm | 3A | |
| Clamping Voltage VC | 13.7V | |
| Number of Elements per Chip | 4 | |
| Maximum Operating Temperature | 150°C | |
| Height | 350μm | |
| Width | 900μm | |
| Length | 1.4mm | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Maximum Reverse Leakage Current | 70nA | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Direction Type Uni-Directional | ||
Product Type TVS Diode | ||
Diode Configuration Array | ||
Minimum Breakdown Voltage Vbr 5.7V | ||
Mount Type Surface | ||
Package Type DFN | ||
Maximum Reverse Stand-off Voltage Vwm 5V | ||
Pin Count 5 | ||
Minimum Operating Temperature -40°C | ||
ESD Protection Yes | ||
Maximum Peak Pulse Current Ippm 3A | ||
Clamping Voltage VC 13.7V | ||
Number of Elements per Chip 4 | ||
Maximum Operating Temperature 150°C | ||
Height 350μm | ||
Width 900μm | ||
Length 1.4mm | ||
Standards/Approvals No | ||
Automotive Standard No | ||
Maximum Reverse Leakage Current 70nA | ||
- COO (Country of Origin):
- CN
The HSP051-4M5 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
Very compact 500 μm pitch package, for easy PCB layout
Very-large bandwidth: 11.5 GHz
Very-low capacitance: 0.2 pF (I/O to I/O) and 0.35 pF (I/O to GND)
Very low dynamic resistance : 0.35 Ω
Low leakage current: < 1 nA
High ESD protection level
High integration
Suitable for high density boards
Extended operating junction temperature range : -40 °C to 150 °C
±20 kV (contact discharge)
±30 kV (air discharge)
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