Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.125in Thick, 5W/m·K, Silicone, 16 x 8 x 0.125in
- RS Stock No.:
- 282-6833
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.125 sh
- Manufacturer:
- Bergquist
Temporarily out of stock - back order for despatch 13/09/2024, delivery within 5 working days from despatch date
Price Each
SGD613.64
(exc. GST)
SGD668.87
(inc. GST)
Units | Per unit |
|---|---|
| 1 + | SGD613.64 |
- RS Stock No.:
- 282-6833
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.125 sh
- Manufacturer:
- Bergquist
Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
- COO (Country of Origin):
- US
Product Details
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance low compression stress
Fiberglass reinforced for shear and tear resistance
Fiberglass reinforced for shear and tear resistance
Specifications
Attribute | Value |
|---|---|
| Dimensions | 16 x 8 x 0.125in |
| Thickness | 0.125in |
| Length | 16in |
| Width | 8in |
| Thermal Conductivity | 5W/m·K |
| Material | Silicone |
| Self-Adhesive | Yes |
| Series | HC5000 |