- RS Stock No.:
- 282-6755
- Mfr. Part No.:
- GAP PAD TGP 2200SF, 16in x 8in x 0.125 sh
- Manufacturer:
- Bergquist
Temporarily out of stock - back order for despatch 13/09/2024, delivery within 5 working days from despatch date
Price Each
SGD335.81
(exc. GST)
SGD366.03
(inc. GST)
Units | Per unit |
---|---|
1 + | SGD335.81 |
- RS Stock No.:
- 282-6755
- Mfr. Part No.:
- GAP PAD TGP 2200SF, 16in x 8in x 0.125 sh
- Manufacturer:
- Bergquist
Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
- COO (Country of Origin):
- US
Product Details
The Bergquist Silicone-Free Formulation, High Performance Thermally Conductive Material. It is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The compound is silicone free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
Specifications
Attribute | Value |
---|---|
Dimensions | 16 x 8 x 0.125in |
Thickness | 0.125in |
Length | 16in |
Width | 8in |
Thermal Conductivity | 2W/m·K |
Material | TIM |
Self-Adhesive | Yes |
Series | 2200SF |