Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 6 W/mK, 100 mm, 100mm, Ceramic Filled Silicone Rubber
- RS Stock No.:
- 242-0136
- Distrelec Article No.:
- 302-53-083
- Mfr. Part No.:
- 40016010
- Manufacturer:
- Wurth Elektronik
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SGD26.09
(exc. GST)
SGD28.44
(inc. GST)
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Units | Per unit |
|---|---|
| 1 - 4 | SGD26.09 |
| 5 - 9 | SGD25.26 |
| 10 + | SGD24.43 |
*price indicative
- RS Stock No.:
- 242-0136
- Distrelec Article No.:
- 302-53-083
- Mfr. Part No.:
- 40016010
- Manufacturer:
- Wurth Elektronik
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Wurth Elektronik | |
| Product Type | Thermal Gap Pad | |
| Thickness | 1mm | |
| Thermal Conductivity | 6W/mK | |
| Trade Name | Würth Elektronik | |
| Conductive Material | Ceramic Filled Silicone Rubber | |
| Hardness | 35 Shore C | |
| Standards/Approvals | REACh Approval Conform or declared ((EC) 1907/2006), Halogen Free Conform (IEC 61249-2-21), RoHS Approval Compliant (2011/65/EU&2015/863), Halogen Free Conform (JEDEC JS709B) | |
| Length | 100mm | |
| Width | 100mm | |
| Colour | Grey | |
| Series | WE-TGF | |
| Minimum Operating Temperature | -50°C | |
| Maximum Operating Temperature | 150°C | |
| Select all | ||
|---|---|---|
Brand Wurth Elektronik | ||
Product Type Thermal Gap Pad | ||
Thickness 1mm | ||
Thermal Conductivity 6W/mK | ||
Trade Name Würth Elektronik | ||
Conductive Material Ceramic Filled Silicone Rubber | ||
Hardness 35 Shore C | ||
Standards/Approvals REACh Approval Conform or declared ((EC) 1907/2006), Halogen Free Conform (IEC 61249-2-21), RoHS Approval Compliant (2011/65/EU&2015/863), Halogen Free Conform (JEDEC JS709B) | ||
Length 100mm | ||
Width 100mm | ||
Colour Grey | ||
Series WE-TGF | ||
Minimum Operating Temperature -50°C | ||
Maximum Operating Temperature 150°C | ||
Wurth Elektronik WE-TGF Series Thermal Gap Pad, 6W/mk Thermal Conductivity, Grey - 40016010
This thermal gap pad provides a compliant thermal Interface for transferring heat between uneven surfaces in electronic assemblies. It is a ceramic-filled silicone rubber material designed to bridge gaps while maintaining consistent performance across a wide temperature range. The product is supplied as a 100 x 100mm sheet with 1mm thickness suitable for integration where a resilient, thermally conductive gap filler is required.
Features and Benefits:
• 6W/mK conductivity enables efficient heat transfer
• Ceramic-filled silicone offers electrical insulation and a thermal path
• 35 Shore C hardness provides controlled compression under load
• -50°C to 150°C range supports extreme operating temperatures
• Halogen-free formulation reduces the risk of corrosive residues
• Ceramic-filled silicone offers electrical insulation and a thermal path
• 35 Shore C hardness provides controlled compression under load
• -50°C to 150°C range supports extreme operating temperatures
• Halogen-free formulation reduces the risk of corrosive residues
Applications
• Suitable for heat-spreading between electronic modules and heatsinks
• Used with Power Semiconductors requiring gap filling
• Ideal for thermal management in Compact enclosures
• Can be used for assembly where halogen-free materials are required
• Used for replacing conformal gap fillers in retrofit projects
• Used with Power Semiconductors requiring gap filling
• Ideal for thermal management in Compact enclosures
• Can be used for assembly where halogen-free materials are required
• Used for replacing conformal gap fillers in retrofit projects
What material properties influence compressibility?
The silicone Matrix combined with ceramic filler and a hardness of 35 Shore C determines compressive response and gap-conforming behaviour.
How should the sheet be prepared for custom shapes?
It can be cut to size from the 100 x 100mm sheet using a Sharp blade or die, ensuring straight edges for optimal Interface contact.
What environmental limits affect long-term performance?
Continuous exposure beyond -50°C or 150°C may change mechanical properties and reduce thermal transfer efficiency.
Is this suitable for electrically sensitive assemblies?
The ceramic-filled silicone formulation provides a thermally conductive yet electrically insulating Interface for many electronic components.
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