STMicroelectronics STM32WB55RGV6 CMOS Wireless System On Chip SOC 68-Pin VFQFPN

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Subtotal (1 tray of 260 units)*

SGD3,084.64

(exc. GST)

SGD3,362.32

(inc. GST)

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  • Shipping from 31 May 2027
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Units
Per unit
Per Tray*
260 - 520SGD11.864SGD3,084.64
780 - 1040SGD11.419SGD2,968.94
1300 +SGD10.705SGD2,783.30

*price indicative

RS Stock No.:
192-3632
Mfr. Part No.:
STM32WB55RGV6
Manufacturer:
STMicroelectronics
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Brand

STMicroelectronics

Product Type

Wireless System On Chip SOC

Processing Unit

Bluetooth

Technology

CMOS

Mount Type

Surface

Package Type

VFQFPN

Clock Frequency

64MHz

Pin Count

68

Interface Type

SPI

Program Memory Size

512kB

Program Memory Type

FLASH

Minimum Supply Voltage

1.71V

Maximum Supply Voltage

3.6V

Data RAM Size

256kB

Data RAM Type

SRAM

Number of I/Os

72

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Series

STM32WB

Standards/Approvals

No

Length

8.15mm

Height

950μm

Width

8.15mm

Automotive Standard

No

COO (Country of Origin):
PH
Wireless and ultra-low-power devices embed a powerful and ultra-low-power radio. They contain a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.

Designed to be extremely low-power and are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision that supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.

Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.

High-speed memories (Flash memory up to 1 Mbyte, up to 256 Kbyte of SRAM), a Quad-SPI Flash memory interface (available on all packages) and an extensive range of enhanced I/Os and peripherals.

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