Samtec ASP Series Straight Surface PCB Socket, 50-Contact, 2 Row, 0.8 mm Pitch Solder
- RS Stock No.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
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Subtotal (1 unit)*
SGD10.74
(exc. GST)
SGD11.71
(inc. GST)
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- Shipping from 18 May 2026
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Units | Per unit |
|---|---|
| 1 - 24 | SGD10.74 |
| 25 - 99 | SGD10.41 |
| 100 - 249 | SGD9.99 |
| 250 - 499 | SGD9.49 |
| 500 + | SGD8.91 |
*price indicative
- RS Stock No.:
- 180-2773
- Mfr. Part No.:
- ASP-148422-01
- Manufacturer:
- Samtec
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 50 | |
| Sub Type | Socket Assembly | |
| Number of Rows | 2 | |
| Pitch | 0.8mm | |
| Current | 2.7A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 22mm | |
| Connector System | Board-to-Board | |
| Series | ASP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 3.36mm | |
| Contact Plating | Gold over Nickel | |
| Contact Gender | Female | |
| Contact Material | Beryllium Copper Alloy | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 50 | ||
Sub Type Socket Assembly | ||
Number of Rows 2 | ||
Pitch 0.8mm | ||
Current 2.7A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 22mm | ||
Connector System Board-to-Board | ||
Series ASP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 3.36mm | ||
Contact Plating Gold over Nickel | ||
Contact Gender Female | ||
Contact Material Beryllium Copper Alloy | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
The Samtec PCB Socket ASP series is a surface mount PCB socket. As advances in semiconductor and system design continue, embedded applications are using higher performance embedded processors. Efficient use of these embedded processors requires software and hardware development tools that can easily access critical processor functionality.
Contact Plating: Gold over Nickel
Contact Material: Beryllium Copper
Related links
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