Molex 44769 Series Vertical Through Hole Receptacle, 8-Contact, 2 Row, 3 mm Pitch Through Hole

N

Subtotal (1 tray of 50 units)*

SGD470.51

(exc. GST)

SGD512.86

(inc. GST)

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Tray(s)
Per Tray
Per unit*
1 +SGD470.51SGD9.41

*price indicative

RS Stock No.:
694-096
Mfr. Part No.:
44769-0802
Manufacturer:
Molex
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Brand

Molex

Number of Contacts

8

Product Type

Receptacle

Number of Rows

2

Sub Type

PCB Receptacle

Pitch

3mm

Current

8.5A

Termination Type

Through Hole

Housing Material

Liquid Crystal Polymer

Mount Type

Through Hole

Orientation

Vertical

Connector System

Wire-to-Board

Voltage

600V

Series

44769

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Plating

Gold

Contact Material

Phosphor Bronze

Standards/Approvals

REACH SVHC

COO (Country of Origin):
US
The Molex Micro-Fit BMI Receptacle Header is engineered to facilitate seamless board-to-board and wire-to-board connections with a robust design featuring dual rows and vertical orientation. Built with precision, this receptacle utilizes press-fit plastic pegs and is plated with 0.38μm gold for superior conductivity and reliability over time. Its eight-circuit capability makes it a versatile choice for power applications within Compact electronic assemblies. Designed to endure up to 30 mating cycles, this receptacle offers enhanced durability, while its low-halogen and industry compliance certifications ensure its adherence to contemporary environmental standards. With an optimal operational temperature range of -40° to +105°C, this product is adaptable for various functional environments.

Features a temperature range of -40° to +105°C, Ideal for diverse operational settings

Equipped with press-fit plastic pegs, ensuring secure integration onto PCBs

Plated with 0.38μm gold for reliable conductivity, enhancing electrical performance

Dual rows provide efficient space utilization while maintaining high circuit density

Meets industry compliance standards, ensuring quality and reliability for various applications

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