Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 8 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

RS Stock No.:: 670-4821
Mfr. Part No.:: 43650-0829
Manufacturer:: Molex

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 8 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded

This image is representative of the product range

Bulk discount available

Subtotal (1 pack of 5 units)**

SGD12.33

(exc. GST)

SGD13.44

(inc. GST)

Temporarily out of stock - back order for despatch 18/08/2025, delivery within 4 working days from despatch date*

* Delivery dates may change based on your chosen quantity and delivery address.

FREE delivery for orders over SGD150.00 (ex GST)

Units	Per unit	Per Pack**
5 - 95	SGD2.466	SGD12.33
100 - 370	SGD2.416	SGD12.08
375 - 1495	SGD2.368	SGD11.84
1500 - 2995	SGD2.32	SGD11.60
3000 +	SGD2.276	SGD11.38

**price indicative

RS Stock No.:: 670-4821
Mfr. Part No.:: 43650-0829
Manufacturer:: Molex

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with PCB Polarizing Peg, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx15, xx16 and xx17 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

• Kinked solder legs for additional PCB retention

• Glow Wire Compliant

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.

Molex Micro-Fit 3.0 Series

Attribute	Value
Series	Micro-Fit 3.0
Pitch	3.0mm
Number of Contacts	8
Number of Rows	1
Body Orientation	Straight
Shrouded/Unshrouded	Shrouded
Connector System	Wire to Board
Mounting Type	Through Hole
Termination Method	Solder
Contact Material	Brass
Contact Plating	Gold
Current Rating	5.0A
Series Number	43650
Voltage Rating	250 V ac