Molex Micro-Fit 3.0 Series Vertical Through Hole PCB Header, 16 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

• High current carrying capacity in a small footprint
• High temperature housings for IR reflow soldering
• Through hole versions SMT compatible
• Positive latching for secure mating connection
• Fully isolated dual beam terminals for reliable electrical performance and contact
• PCB polarising pegs for alignment and positioning on PCB

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals

This PCB header is a crucial component within the Micro-Fit 3.0 circuit connection system, tailored for high-performance applications across various electronic and electrical sectors. It ensures dependable wire-to-board connections, playing a key role in effective power management in automation and mechanical industries.

• Fully shrouded and polarised for enhanced safety during operation
• Compatible with 3.0mm pitch headers for versatile integration
• Constructed from durable materials for longevity and consistent performance

• Suitable for automation equipment needing robust wire-to-board connections
• Applicable in electrical projects requiring high current capacity
• Ideal for connecting various PCB designs in mechanical systems

The optimal PCB thickness for this connection is 1.60mm to ensure proper fitting and reliability.

It can withstand up to 30 mating cycles, suitable for frequent connections and disconnections in industrial applications.

It operates effectively across a temperature range of -40° to +105°C, ensuring functionality in diverse environments.

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Molex Micro-Fit 3.0 Series