Amphenol ICC 65863 Series Vertical Through Hole Header, 40 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 797-193
- Mfr. Part No.:
- 65863-085LF
- Manufacturer:
- Amphenol ICC
N
Subtotal (1 tray of 100 units)*
SGD455.01
(exc. GST)
SGD495.96
(inc. GST)
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Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | SGD455.01 | SGD4.55 |
*price indicative
- RS Stock No.:
- 797-193
- Mfr. Part No.:
- 65863-085LF
- Manufacturer:
- Amphenol ICC
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | Header | |
| Series | 65863 | |
| Pitch | 2.54mm | |
| Number of Contacts | 40 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Nickel | |
| Row Pitch | 2.54mm | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type Header | ||
Series 65863 | ||
Pitch 2.54mm | ||
Number of Contacts 40 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Contact Plating Nickel | ||
Row Pitch 2.54mm | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CN
The Amphenol ICC Header is designed for reliable flat cable-to-board connections utilising 2.54mm pitch IDC technology, ensuring Durable and cost-effective performance suitable for various applications.
Low profile shrouded design prevents pin misalignment during assembly
Duplex plating guarantees over 100 mating cycles while being cost-efficient
Four-walled headers protect pins in unmated conditions from damage
Eject latch system allows for dense packaging designs on PCBs