Molex 171974 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
N
Subtotal (1 tube of 420 units)*
SGD742.71
(exc. GST)
SGD809.55
(inc. GST)
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | SGD742.71 | SGD1.768 |
*price indicative
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 171974 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Polymer | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 171974 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Polymer | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex PCB header is designed to provide reliable and efficient electrical connections across various applications, optimising performance and durability in demanding environments.
Robust design ensures exceptional reliability in challenging conditions
Facilitates seamless integration with a wide range of existing systems
Offers versatility for various connectivity configurations
Enhances performance with high-speed data transmission capabilities
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