Molex 4455 Series Right Angle Through Hole PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-525
- Mfr. Part No.:
- 22-16-2120
- Manufacturer:
- Molex
N
Subtotal (1 tray of 200 units)*
SGD699.34
(exc. GST)
SGD762.28
(inc. GST)
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- Shipping from 18 September 2026
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Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | SGD699.34 | SGD3.497 |
*price indicative
- RS Stock No.:
- 787-525
- Mfr. Part No.:
- 22-16-2120
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 4455 | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Housing Material | Nylon | |
| Number of Contacts | 12 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 4455 | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Housing Material Nylon | ||
Number of Contacts 12 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Offers enhanced connectivity through its robust design
Facilitates easy installation with user-friendly features
Supports high-speed data transfer for modern electronic devices
Constructed to withstand rigorous industrial environments
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