Molex 3099 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-514
- Mfr. Part No.:
- 22-14-2104
- Manufacturer:
- Molex
N
Subtotal (1 tray of 200 units)*
SGD418.01
(exc. GST)
SGD455.63
(inc. GST)
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- Shipping from 13 October 2026
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Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | SGD418.01 | SGD2.09 |
*price indicative
- RS Stock No.:
- 787-514
- Mfr. Part No.:
- 22-14-2104
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 3099 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Number of Contacts | 10 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 3099 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Number of Contacts 10 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex PCB Header is designed for reliable and efficient electrical connections in various applications. They ensure secure connections between circuit boards and other devices.
Available in multiple standards for flexibility in design
Optimised for high-performance environments to enhance reliability
Facilitates easy assembly and maintenance, reducing downtime
Offers diverse configurations to meet specific connectivity needs
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