Amphenol ICC 20021111 Series Straight Through Hole PCB Header, 16 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded
- RS Stock No.:
- 786-383
- Mfr. Part No.:
- 20021111-00016T4LF
- Manufacturer:
- Amphenol ICC
N
Subtotal (1 tube of 200 units)*
SGD349.58
(exc. GST)
SGD381.04
(inc. GST)
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Tube(s) | Per Tube | Per unit* |
|---|---|---|
| 1 + | SGD349.58 | SGD1.748 |
*price indicative
- RS Stock No.:
- 786-383
- Mfr. Part No.:
- 20021111-00016T4LF
- Manufacturer:
- Amphenol ICC
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 20021111 | |
| Pitch | 1.27mm | |
| Number of Contacts | 16 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Copper | |
| Contact Material | Copper | |
| Termination Type | Through Hole | |
| Row Pitch | 1.27mm | |
| Contact Gender | Male | |
| Select all | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type PCB Header | ||
Series 20021111 | ||
Pitch 1.27mm | ||
Number of Contacts 16 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Copper | ||
Contact Material Copper | ||
Termination Type Through Hole | ||
Row Pitch 1.27mm | ||
Contact Gender Male | ||
- COO (Country of Origin):
- CN
The Amphenol Connector solution designed for varied applications, ensuring secure and efficient connectivity in demanding environments. Its robust construction and functionality support seamless integration into existing systems.
Manufactured to meet stringent industry standards for quality and performance
Features a Compact design that allows for easy installation in space-constrained areas
Constructed from Durable materials, ensuring longevity and resistance to environmental factors
Designed for high-performance applications, facilitating optimal data transmission and connectivity
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