Molex 203556 Series Vertical Surface Mount PCB Header, 4 Contact(s), 1 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 786-079
- Mfr. Part No.:
- 203556-0407
- Manufacturer:
- Molex
N
Subtotal (1 reel of 1100 units)*
SGD2,696.86
(exc. GST)
SGD2,939.58
(inc. GST)
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- Shipping from 20 October 2026
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Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | SGD2,696.86 | SGD2.452 |
*price indicative
- RS Stock No.:
- 786-079
- Mfr. Part No.:
- 203556-0407
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 203556 | |
| Pitch | 1mm | |
| Housing Material | Polyamide | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface Mount | |
| Connector System | Wire-to-Board | |
| Contact Material | Bronze | |
| Contact Plating | Gold | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 203556 | ||
Pitch 1mm | ||
Housing Material Polyamide | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface Mount | ||
Connector System Wire-to-Board | ||
Contact Material Bronze | ||
Contact Plating Gold | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- COO (Country of Origin):
- VN
The Molex PCB Header is designed to deliver reliable electrical connections in diverse applications. Its Compact form factor makes it Ideal for use in space-constrained environments.
1.00mm pitch design enables efficient space utilisation on PCBs
Friction lock feature ensures secure connections, reducing the risk of disconnection
Gold plating of 0.38μm enhances conductivity and corrosion resistance
Single-row configuration simplifies installation and reduces complexity
Surface mount capability streamlines assembly and integration into electronic devices
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