STMicroelectronics Sensor, VFLGA, SPI, 14L-Pin

RS Stock No.:: 193-5450
Mfr. Part No.:: ISM330DHCXTR
Manufacturer:: STMicroelectronics

STMicroelectronics Sensor, VFLGA, SPI, 14L-Pin

This image is representative of the product range

Bulk discount available

Subtotal (1 reel of 5000 units)**

SGD50,825.00

(exc. GST)

SGD55,400.00

(inc. GST)

Temporarily out of stock - back order for despatch 02/02/2026, delivery within 4 working days from despatch date*

* Delivery dates may change based on your chosen quantity and delivery address.

FREE delivery for orders over SGD250.00 (ex GST)

Units	Per unit	Per Reel**
5000 - 20000	SGD10.165	SGD50,825.00
25000 +	SGD9.961	SGD49,805.00

**price indicative

RS Stock No.:: 193-5450
Mfr. Part No.:: ISM330DHCXTR
Manufacturer:: STMicroelectronics

The STMicroelectronics ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.

The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.

All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.

An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.

The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

Key Features

3D accelerometer with selectable full scale: ±2/±4/±8/±16 g

3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps

Extended temperature range from -40 to +105 °C

Embedded compensation for high stability over temperature

SPI/I²C serial interface

Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)

Six-channel synchronized output

Sensor hub feature to efficiently collect data from additional external sensors

Embedded smart FIFO up to 9 kbytes

Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors

Machine Learning Core

Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click

Embedded pedometer, step detector and counter for healthcare applications

Analog supply voltage: 1.71 V to 3.6 V

Embedded temperature sensor

Embedded self-test both for gyroscope and accelerometer

High shock survivability

ECOPACK, RoHS and “Green” compliant

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Manufacturer	STMicroelectronics
	Technology	Gyroscope
	Interface Type	SPI
	Package Type	VFLGA
	Pin Count	14L
	Maximum Operating Temperature	+105 °C
	Minimum Operating Temperature	-40 °C

STMicroelectronics Sensor, VFLGA, SPI, 14L-Pin

FREE delivery for orders over SGD250.00 (ex GST)

Key Features

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