TDK 2.2 μF Multilayer Ceramic Capacitor, 50V dc, ±10 %, Surface
- RS Stock No.:
- 183-5892P
- Mfr. Part No.:
- CGA6N3X7R2A225K230AE
- Manufacturer:
- TDK
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View bulk pricing optionsSubtotal 100 units (supplied on a continuous strip)*
SGD99.60
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SGD108.60
(inc. GST)
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- Shipping from 02 December 2026
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Units | Per unit |
|---|---|
| 100 - 240 | SGD0.996 |
| 250 - 490 | SGD0.953 |
| 500 + | SGD0.879 |
*price indicative
- RS Stock No.:
- 183-5892P
- Mfr. Part No.:
- CGA6N3X7R2A225K230AE
- Manufacturer:
- TDK
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 2.2μF | |
| Voltage | 50V dc | |
| Construction | Multi-layer | |
| Package/Case | 1210 | |
| Packaging | 7 in Reel | |
| Mount Type | Surface | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Width | 2.5mm | |
| Height | 2.5mm | |
| Length | 3.2mm | |
| Standards/Approvals | No | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 2.2μF | ||
Voltage 50V dc | ||
Construction Multi-layer | ||
Package/Case 1210 | ||
Packaging 7 in Reel | ||
Mount Type Surface | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Width 2.5mm | ||
Height 2.5mm | ||
Length 3.2mm | ||
Standards/Approvals No | ||
Maximum Operating Temperature 125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor Soft termination CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and smart-key.