OIS-170-880-X-T EPIGAP OSA Photonics OIS-170 880 nm IR LED 0805 Surface Mount package
- RS Stock No.:
- 173-6322
- Mfr. Part No.:
- OIS-170-880-X-T
- Manufacturer:
- EPIGAP OSA Photonics
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Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 173-6322
- Mfr. Part No.:
- OIS-170-880-X-T
- Manufacturer:
- EPIGAP OSA Photonics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Product Type | IR LED | |
| Peak Wavelength | 880nm | |
| Package Type | 0805 | |
| Radiant Flux | 6.3mW | |
| Radiant Intensity | 2.1mW/sr | |
| Packaging | Tape | |
| Mount Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Lens Shape | Square | |
| Series | OIS-170 | |
| LED Material | AlInGaP, GaP, InGaN, GaAlAs | |
| Standards/Approvals | No | |
| Maximum Supply Voltage | 1.7V | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Product Type IR LED | ||
Peak Wavelength 880nm | ||
Package Type 0805 | ||
Radiant Flux 6.3mW | ||
Radiant Intensity 2.1mW/sr | ||
Packaging Tape | ||
Mount Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Lens Shape Square | ||
Series OIS-170 | ||
LED Material AlInGaP, GaP, InGaN, GaAlAs | ||
Standards/Approvals No | ||
Maximum Supply Voltage 1.7V | ||
Automotive Standard No | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
circuit substrate:glass laminated epoxy
lead free solderable, soldering pads: Gold plated
taped in 8 mm blister tape, cathod to transporting perforation
all devices sorted into luminous intensity classes
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