Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): DE
Product Details

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).


Features and Benefits

Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

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BGA Heatsinks

Specifications
Attribute Value
For Use With Universal Square Alu
Length 27mm
Width 27mm
Height 22mm
Dimensions 27 x 27 x 22mm
Thermal Resistance 13.5K/W
Mounting Adhesive Foil, Conductive Foil
Colour Black
Package Type BGA
77 In stock for delivery within 5 working days
Price Each
SGD 6.99
(exc. GST)
SGD 7.48
(inc. GST)
units
Per unit
1 - 9
SGD6.99
10 - 49
SGD6.78
50 - 99
SGD6.59
100 - 249
SGD6.43
250 +
SGD6.31
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