Heatsink, BGA, 35 x 35 x 12mm, Clip

  • RS Stock No. 489-6108
  • Mfr. Part No. MBH35002-12P/2.6
  • Manufacturer Malico
Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): TW
Product Details

BGA Chipset Heat Sinks

High-performance precision-forged clip-attachment heatsinks for BGA chipsets.

AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop

BGA Heatsinks

Specifications
Attribute Value
For Use With Clip
Length 35mm
Width 35mm
Height 12mm
Dimensions 35 x 35 x 12mm
Mounting Clip
Colour Black
95 In stock for delivery within 3 working days
Price Each
SGD 8.73
(exc. GST)
SGD 9.34
(inc. GST)
units
Per unit
1 - 49
SGD8.73
50 - 99
SGD7.65
100 - 249
SGD6.58
250 - 499
SGD5.52
500 +
SGD4.83
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