Heatsink, BGA, 8.5K/W, 38 x 38 x 23mm, Clip

Aluminium heatsink solutions suitable for variety of BGA packages. Used to provide thermal stability of electronic components and temperature dependent processes where thermal runaway would damage the operation or reliability.

Mechanical fixing (variation between heat sinks)
Developed for mass production and high volume applications, where combination of cost and performance is critical
Integrated interface material (check heat sink) for complete solution
Ideally suited for both natural and forced convection

BGA Heatsinks