TE Connectivity Right Angle Edge Connector, PCB, 67-Contacts, 0.5 mm Pitch, 2 Row
- RS Stock No.:
- 255-7447
- Mfr. Part No.:
- 1-2199119-5
- Manufacturer:
- TE Connectivity
This image is representative of the product range
Bulk discount available
Subtotal (1 tape of 10 units)*
SGD20.79
(exc. GST)
SGD22.66
(inc. GST)
FREE delivery for orders over $150, or create a business account to enjoy free delivery from just $28
In Stock
- 3,980 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Tape* |
|---|---|---|
| 10 - 90 | SGD2.079 | SGD20.79 |
| 100 - 190 | SGD2.045 | SGD20.45 |
| 200 - 590 | SGD1.976 | SGD19.76 |
| 600 + | SGD1.779 | SGD17.79 |
*price indicative
- RS Stock No.:
- 255-7447
- Mfr. Part No.:
- 1-2199119-5
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | Edge Connector | |
| Orientation | Right Angle | |
| Current | 0.5A | |
| Number of Contacts | 67 | |
| Number of Rows | 2 | |
| Pitch | 0.5mm | |
| Mount Type | PCB | |
| Contact Plating | Nickel | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 80°C | |
| Voltage | 50V | |
| Housing Material | High Temperature Thermoplastic | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type Edge Connector | ||
Orientation Right Angle | ||
Current 0.5A | ||
Number of Contacts 67 | ||
Number of Rows 2 | ||
Pitch 0.5mm | ||
Mount Type PCB | ||
Contact Plating Nickel | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 80°C | ||
Voltage 50V | ||
Housing Material High Temperature Thermoplastic | ||
Standards/Approvals RoHS | ||
The TE Connectivity M.2 Next Generation Form Factor (NGFF) product line is a natural transition from the mini card and half-mini card to a smaller form factor in both size and volume. The Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors.
Board-to-Board connector system
Housing made of high temperature thermoplastic
Black coated housing
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