Vero Technologies 64 Way Backplane Epoxy Glass Fabric Laminate 1 84 HP With 15.24 mm Connector Pitch

RS Stock No.:: 435-327
Mfr. Part No.:: 222-29824
Manufacturer:: Vero Technologies

Vero Technologies 64 Way Backplane Epoxy Glass Fabric Laminate 1 84 HP With 15.24 mm Connector Pitch

Subtotal (1 unit)*

SGD153.49

(exc. GST)

SGD167.30

(inc. GST)

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4 unit(s) shipping from 13 February 2026

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Units	Per unit
1 +	SGD153.49

*price indicative

RS Stock No.:: 435-327
Mfr. Part No.:: 222-29824
Manufacturer:: Vero Technologies

Specifications

Technical data sheets

Legislation and Compliance

Product Details

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Select all	Attribute	Value
	Brand	Vero Technologies
	Product Type	Backplane
	Number of Contacts	64
	Board Material	Epoxy Glass Fabric Laminate
	Number of Sides	1
	Horizontal Pitch	84HP
	Pitch	15.24mm
	Copper Thickness	70μm
	External Width	20mm
	Board Thickness	1.6mm
	Standards/Approvals	RoHS, BS 4584, EP-GC-Cu3 FR4

	Select all
	Brand Vero Technologies
	Product Type Backplane
	Number of Contacts 64
	Board Material Epoxy Glass Fabric Laminate
	Number of Sides 1
	Horizontal Pitch 84HP
	Pitch 15.24mm
	Copper Thickness 70μm
	External Width 20mm
	Board Thickness 1.6mm
	Standards/Approvals RoHS, BS 4584, EP-GC-Cu3 FR4

Datasheet - 222-29824

COO (Country of Origin):: GB

Single-Sided Eurocard Backplanes

A 64-way single-sided Eurocard backplane suitable for use with 64//96 (a/c) DIN 41612 indirect edge connectors, in conjunction with Eurocard sub-racks to DIN 41494, e.g. the RS eurocard sub-rack system (except 4HP and 10HP card fronts).,Dimensions: Height 3U. Width 84HP. Pitch 0.6 in (15.24 mm). Lines 1, 2, 31 and 32 (a and c) are fully bussed for 3 rail and 0V power distribution.The absence of a grounding plane makes this backplane ideal for slow-speed non critical applications.,Mounting arrangements onto the RS sub-rack system is as depicted for the double-sided type

PC / VME Bus Boards

PC Compatible Prototyping Boards

Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m² (1 oz/ft²). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix.

Microboard Pattern

Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.

Supplied with

2 insulated mounted strips