Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.125in Thick, 2W/m·K, Silicone, 8 x 16 x 0.125in
- RS Stock No.:
- 282-6748
- Mfr. Part No.:
- GAP PAD TGP 2000, 8in x 16in x 0.125
- Manufacturer:
- Bergquist
Temporarily out of stock - back order for despatch 13/09/2024, delivery within 5 working days from despatch date
Price Each
SGD377.25
(exc. GST)
SGD411.20
(inc. GST)
Units | Per unit |
---|---|
1 + | SGD377.25 |
- RS Stock No.:
- 282-6748
- Mfr. Part No.:
- GAP PAD TGP 2000, 8in x 16in x 0.125
- Manufacturer:
- Bergquist
Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
- COO (Country of Origin):
- US
Product Details
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Specifications
Attribute | Value |
---|---|
Dimensions | 8 x 16 x 0.125in |
Thickness | 0.125in |
Length | 8in |
Width | 16in |
Thermal Conductivity | 2W/m·K |
Material | Silicone |
Self-Adhesive | Yes |
Series | TGP 2000 |