SICK Through Beam Photoelectric Sensor, Cylindrical Sensor, 20 mm Detection Range

The UD18-2 specializes in checking for double layers and splices using ultrasonic technology. Operating with precision, it is able to determine whether one, two or no material layers are present between its sender and receiver. Where the UD18-2 really excels is checking for double layers in paper, cardboard, shiny metal, and transparent plastic.

It is possible to teach in up to four sensitivity levels and switch between them during operation, allowing the sensor to tackle even the most complex of applications and ensure permanent system availability with a consistently excellent level of production quality.

Material classifications: no layers, single layer, double layers
Plug-and-play

Maximum productivity and quality thanks to reliable material transportation monitoring
Rapid commissioning thanks to plug-and-play plus a range of sensitivity levels to choose from
Easy to switch between sensitivity levels during operation, preventing downtimes during material changes
Individual teach-in of various materials, making it possible to tackle even the most demanding applications
The utmost flexibility during installation thanks to variable mounting distance
LEDs visible from any direction, making it easy to monitor double sheet detections
Reliable detection in dirty, dusty, and humid conditions thanks to the ultrasonic technology's immunity to these environments

Fields of applications
Double layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards
Checking material transportation upstream of presses, printing machines, and cutting machines
Splice and label detection
Packaging, process