TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder
- RS Stock No.:
- 718-1538
- Mfr. Part No.:
- 5-5223955-2
- Manufacturer:
- TE Connectivity
This image is representative of the product range
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Subtotal (1 unit)*
SGD7.23
(exc. GST)
SGD7.88
(inc. GST)
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Last RS stock
- Final 110 unit(s), ready to ship from another location
Units | Per unit |
|---|---|
| 1 - 19 | SGD7.23 |
| 20 - 74 | SGD7.02 |
| 75 - 299 | SGD6.81 |
| 300 - 599 | SGD6.60 |
| 600 + | SGD6.40 |
*price indicative
- RS Stock No.:
- 718-1538
- Mfr. Part No.:
- 5-5223955-2
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Number of Contacts | 3 | |
| Product Type | PCB Socket | |
| Sub Type | Board-to-Board | |
| Current | 1.15A | |
| Pitch | 2.54mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 250 V | |
| Series | Z-PACK HM | |
| Minimum Operating Temperature | -65°C | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | RoHS | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Number of Contacts 3 | ||
Product Type PCB Socket | ||
Sub Type Board-to-Board | ||
Current 1.15A | ||
Pitch 2.54mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 250 V | ||
Series Z-PACK HM | ||
Minimum Operating Temperature -65°C | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- US
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.
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