Samtec ASP Series Straight Surface PCB Socket, 160-Contact, 2 Row, 0.5 mm Pitch Solder

This image is representative of the product range

Bulk discount available

Subtotal (1 unit)*

SGD16.45

(exc. GST)

SGD17.93

(inc. GST)

Add to Basket
Select or type quantity
In Stock
  • 12 unit(s) ready to ship from another location
  • Plus 23 unit(s) shipping from 27 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
1 - 9SGD16.45
10 - 49SGD16.10
50 - 99SGD15.61
100 - 249SGD15.14
250 +SGD14.70

*price indicative

RS Stock No.:
180-4894
Mfr. Part No.:
ASP-122952-01
Manufacturer:
Samtec
Find similar products by selecting one or more attributes.
Select all

Brand

Samtec

Product Type

PCB Socket

Number of Contacts

160

Number of Rows

2

Sub Type

Terminal Assembly

Pitch

0.5mm

Current

2.7A

Housing Material

Liquid Crystal Polymer

Termination Type

Solder

Mount Type

Surface

Orientation

Straight

Stacking Height

10mm

Connector System

Board-to-Board

Voltage

339 V

Series

ASP

Row Pitch

6.18mm

Minimum Operating Temperature

-55°C

Contact Plating

Gold over Nickel

Contact Material

Bronze

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

RoHS

COO (Country of Origin):
CR
Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.

Related links