Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 2 Contact(s), 3.0mm Pitch, 1 Row(s), Shrouded
- RS Stock No.:
- 670-4708
- Mfr. Part No.:
- 43650-0203
- Manufacturer:
- Molex
Stock check temporarily unavailable - call for stock availability
Added
Price Each (In a Pack of 5)
SGD1.626
(exc. GST)
SGD1.772
(inc. GST)
Units | Per unit | Per Pack* |
5 - 95 | SGD1.626 | SGD8.13 |
100 - 370 | SGD1.576 | SGD7.88 |
375 - 1495 | SGD1.528 | SGD7.64 |
1500 - 2995 | SGD1.496 | SGD7.48 |
3000 + | SGD1.466 | SGD7.33 |
*price indicative |
- RS Stock No.:
- 670-4708
- Mfr. Part No.:
- 43650-0203
- Manufacturer:
- Molex
Legislation and Compliance
- COO (Country of Origin):
- MX
Product Details
Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Features & Benefits
High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Through hole versions SMT compatible
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solderable retention clips for PCB retention
Glow Wire Compliant
High temperature housings for IR reflow soldering
Through hole versions SMT compatible
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solderable retention clips for PCB retention
Glow Wire Compliant
Kinked solder legs for additional PCB retention
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications. Applications include Military COTS (Commercial Off The Shelf), solar power, consumer products, data communications, medical, telecommunications and gaming terminals
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Molex Micro-Fit 3.0 Series
Specifications
Attribute | Value |
---|---|
Series | Micro-Fit 3.0 |
Pitch | 3.0mm |
Number of Contacts | 2 |
Number of Rows | 1 |
Body Orientation | Right Angle |
Shrouded/Unshrouded | Shrouded |
Connector System | Wire to Board |
Mounting Type | Through Hole |
Termination Method | Solder |
Contact Material | Brass |
Contact Plating | Tin |
Current Rating | 5.0A |
Series Number | 43650 |
Voltage Rating | 250 V |