TDK 10 μF Multilayer Ceramic Capacitor, 35V dc, ±10 %, Surface
- RS Stock No.:
- 179-5143
- Mfr. Part No.:
- C3216X7R1V106K160AE
- Manufacturer:
- TDK
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- RS Stock No.:
- 179-5143
- Mfr. Part No.:
- C3216X7R1V106K160AE
- Manufacturer:
- TDK
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 10μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 35V dc | |
| Package/Case | 1206 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | No | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | C | |
| Height | 1.6mm | |
| Length | 3.2mm | |
| Width | 1.6mm | |
| Standards/Approvals | No | |
| Suppression Class | Class II | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 10μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 35V dc | ||
Package/Case 1206 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard No | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series C | ||
Height 1.6mm | ||
Length 3.2mm | ||
Width 1.6mm | ||
Standards/Approvals No | ||
Suppression Class Class II | ||
Maximum Operating Temperature 125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_General grade_C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.
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