STMicroelectronics, 32 bit ARM Cortex M7, STM32H745ZI Microcontroller, 480 MHz, 2MB FLASH, 144-Pin LQFP

This image is representative of the product range

Subtotal (1 tray of 60 units)*

SGD1,498.14

(exc. GST)

SGD1,632.96

(inc. GST)

Add to Basket
Select or type quantity
In Stock
  • Plus 300 unit(s) shipping from 15 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
Per Tray*
60 +SGD24.969SGD1,498.14

*price indicative

RS Stock No.:
193-5393
Mfr. Part No.:
STM32H745ZIT6
Manufacturer:
STMicroelectronics
Find similar products by selecting one or more attributes.
Select all

Brand

STMicroelectronics

Series

STM32H745ZI

Product Type

Microcontroller

Package Type

LQFP

Mount Type

Surface

Pin Count

144

Device Core

ARM Cortex M7

Data Bus Width

32bit

Program Memory Size

2MB

Maximum Clock Frequency

480MHz

RAM Size

1MB

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Length

22mm

Standards/Approvals

No

Analogue Comparators

2

Number of Programmable I/Os

168

Width

22 mm

Height

1.6mm

DACs

2 x 12 Bit

Minimum Supply Voltage

1.62V

Number of Timers

22

Program Memory Type

FLASH

ADCs

2 x 16 Bit, 1 x 12 Bit

Automotive Standard

No

Instruction Set Architecture

RISC

COO (Country of Origin):
PH
STM32H745xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions, including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H745xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.