Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied in 12 x 18 (305mm x 457mm) or 18 x 24 (457mm x 610mm) sheets, rolls or die-cut to specific configurations. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, minimizing any impact on thermal performance.