Aries Electronics 2.54mm Pitch Vertical 28 Way, Through Hole Closed Frame IC Dip Socket, 3A

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Low Profile DIL Eject Sockets

These sockets have a low profile, with a unique ejector/latching action
They are ideal for use where frequent removal of an IC is anticipated or where vibration may make other types unsuitable. The removal action ensures that the IC pins are undamaged
High reliability is ensured by the collet type contacts, which will accept either round or rectangular pins
The contacts are gold plated over beryllium copper and have tin-plated brass solder tails
Temperature Range: -55°C to +105°C (Tin); -55°C to +125°C (Gold)
Insulation Resistance: 10000MΩ (at 500Vdc)

Attribute Value
Number of Contacts 28
Mounting Type Through Hole
Pitch 2.54mm
Row Width 15.24mm
Frame Type Closed Frame
Termination Method Solder
Contact Plating Gold over Nickel
Current Rating 3A
Orientation Vertical
Length 42.9mm
Width 11.68mm
Depth 17.78mm
Dimensions 42.9 x 11.68 x 17.78mm
Minimum Operating Temperature -55°C
Contact Material Brass Alloy
Housing Material Nylon
Maximum Operating Temperature +125°C
Discontinued product