TE Connectivity IFP/LEC Assembly for use with Intel® Xeon® Phi™ Processor 7200F

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

Cables provide 4x and 8x high speed data transmission lanes
Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs to accommodate cable routing
Bail latch with pull tab on LEC plug and spring latching on IFP plug provides secure connections
Mid-board copper chip-to-I/O interconnect reduces host system board trace lengths and PCB cost
Assemblies utilize TE bulk cable 30 AWG 85 Ohms TurboTwin 25 Gbps primary pair cable
Applications
Data Center & Networking Equipment
Servers
Routers
High Performance Computing (HPC)

Specifications
Attribute Value
Accessory Type IFP/LEC Assembly
For Use With Intel® Xeon® Phi™ Processor 7200F
Series Number 2821723
Temporarily out of stock - back order for despatch 16/09/2020, delivery within 4 working days from despatch date
Price Each
SGD 186.39
(exc. GST)
SGD 199.44
(inc. GST)
units
Per unit
1 - 4
SGD186.39
5 - 9
SGD177.07
10 +
SGD162.32
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