TDK, TFM-ALM, SMD Shielded Multilayer Surface Mount Inductor with a Metal Core, 2.2 μH ±20% 2.4A Idc

By using metal magnetic material with high Saturation magnetic flux density the excellent DC bias characteristics needed for inductors for power circuits can be achieved.
With the same product shape and terminal structure as general chip parts it has excellent mounting stability characteristics and can also be mounted to general-purpose land patterns.
By using a closed magnetic circuit structure leakage flux is minimized.
APPLICATION
Smart phones, tablet terminals, HDDs, SSDs, DVCs, DSCs, mobile display panels, portable game devices, compact power supply modules, other
Application guides: Smart phones/tablets