Heatsink, 2.5K/W, 50 x 88 x 25mm

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): GB
Product Details

Low Profile Non-standard Extrusion With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Note

Thermal resistance quoted is with fins vertical in free air. Length dimension refers to extrusion length along fins. Pre-drilled to take 1 off TO3 metal can semiconuctor package.

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Note

Pre-drilled to take 1 off TO3 metal can semiconuctor package

Specifications
Attribute Value
For Use With Universal Rectangular Alu
Length 50mm
Width 88mm
Height 25mm
Dimensions 50 x 88 x 25mm
Thermal Resistance 2.5K/W
Colour Black
51 In stock for delivery within 3 working days
Price Each
SGD 7.84
(exc. GST)
SGD 8.39
(inc. GST)
units
Per unit
1 - 49
SGD7.84
50 - 99
SGD6.89
100 - 249
SGD5.93
250 - 499
SGD4.98
500 +
SGD4.01
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