TE Connectivity Z-PACK Series 2.5mm Pitch High Speed Hard Metric Backplane Connector, Female, Right Angle, 4 Row, 40 Way

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies

Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.

HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101

Standards

PICMG

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Backplane Connector Type High Speed Hard Metric
Gender Female
Number of Contacts 40
Number of Rows 4
Body Orientation Right Angle
Housing Material PET
Pitch 2.5mm
Contact Material Copper Nickel Silicon Alloy
Mounting Type Through Hole
Contact Plating Gold
Current Rating 700mA
Voltage Rating 250 V ac
Termination Method Press Fit
Series Z-PACK
Maximum Operating Temperature +105°C
Minimum Operating Temperature -65°C
180 In stock for delivery within 4 working days
Price Each (In a Tube of 20)
SGD 22.45
(exc. GST)
SGD 24.02
(inc. GST)
units
Per unit
Per Tube*
20 +
SGD22.45
SGD449.00
*price indicative
Related Products
This Product Specification covers the 7.50 mm (.295 ...
Description:
This Product Specification covers the 7.50 mm (.295 inch) centerline Super-Sabre connector system with silver plating and 10 to 12 AWG wire, 4mm2 Cu-R4TPE 19 x 0.53mm wire and 5mm2 Cu-H1PVC 65 x 0.32mm wire using crimp technology.
The TE Conectivity Z-PACK HS3 board to board ...
Description:
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 ...
TE Connectivity brings you a brilliant range of ...
Description:
TE Connectivity brings you a brilliant range of automotive PCB connector housings. Their 'MULTILOCK 040' series have a compact design with a high density 2.5mm, contact centre. Not to mention, they’re also highly durable and easy to handle. The housing ...
TE Connectivity's range of 'El' (economy interconnection) connector ...
Description:
TE Connectivity's range of 'El' (economy interconnection) connector housings are designed to be compact and an economical solution for high density wiring connections. These connectors feature a locking mechanism to ensure positive mating and are designed to be wire-to-board or ...