TE Connectivity Z-PACK HS3 Series 2.5mm Pitch High Speed Backplane Connector, Male, Straight, 5 Column, 6 Row, 30 Way

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Backplane Connector Type High Speed
Gender Male
Number of Contacts 30
Number of Columns 5
Number of Rows 6
Body Orientation Straight
Housing Material Polyester
Pitch 2.5mm
Contact Material Phosphor Bronze
Contact Plating Tin
Current Rating 1.15A
Voltage Rating 250 V ac
Termination Method Solder
Series Z-PACK HS3
Minimum Operating Temperature -65°C
Maximum Operating Temperature +105°C
Series Number 5120677-1
Temporarily out of stock - back order for despatch 02/11/2020, delivery within 4 working days from despatch date
Price Each (In a Pack of 510)
SGD 9.856
(exc. GST)
SGD 10.546
(inc. GST)
units
Per unit
Per Pack*
510 +
SGD9.856
SGD5,026.56
*price indicative