TE Connectivity Z-PACK Series 2.5mm Pitch Backplane Connector, Right Angle, 2 Row, 40 Way

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CN
Product Details

TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies

Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.

HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101

Standards

PICMG

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Number of Contacts 40
Number of Rows 2
Body Orientation Right Angle
Pitch 2.5mm
Contact Material Copper Nickel Silicon Alloy
Mounting Type Through Hole
Contact Plating Gold
Termination Method Press Fit
Series Z-PACK
Temporarily out of stock - back order for despatch 18/08/2020, delivery within 4 working days from despatch date
Price Each (In a Pack of 400)
SGD 17.39
(exc. GST)
SGD 18.61
(inc. GST)
units
Per unit
Per Pack*
400 +
SGD17.39
SGD6,956.00
*price indicative